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High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment

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High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment

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Brand Name : Unicomp

Model Number : AX9100

Certification : CE, FDA

Place of Origin : China

MOQ : 1 Set

Price : can negotiate

Payment Terms : T/T,L/C

Supply Ability : 30 sets per month

Delivery Time : 30 days

Packaging Details : Wooden Case, Waterproof, Anti-collision

Name : X Ray Pcb Inspection Machine

Application : SMT, EMS,BGA, Electronics, CSP , LED, Semiconductor

Tube Voltage : 130KV

Warranty : 1 Year

Industry : Electronics Industry

Size : 1280(L)x1510(W)x1700(H)mm

X-ray Leakage : < 1uSv/h

Weight : 1750kg

Power Consumption : 1.2kW

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High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment
Product Overview

The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components.

Key Features
  • 130KV 7μm X-Ray tube for precise imaging
  • High-speed, high-resolution FPD with millions of pixels
  • 1000X magnification with high-definition real-time imaging
  • One-button operation with 2.5D image display
  • Off-line programming function with navigation mode detection
  • 7-axis linkage with 70-degree tilt detection capability
Industry Applications
  • SMT, BGA, CSP, Flip Chip, and LED Detection
  • Semiconductor and Packaging Components
  • Battery Industry and Electronic Components
  • Auto Parts and Photovoltaic Industry
  • Aluminum Die-casting and Moulding Plastic
  • Ceramics and Other Special Industries
Customer Services
  • Product project analysis and detection solutions
  • Complimentary sample detection testing
  • Professional detection solution development
  • Expert jig design services
  • Shipping and delivery information verification
  • One-year warranty with lifetime maintenance support
  • 24-hour email response for technical support
Technical Specifications
System Parameters Definition Specifications
Size Dimensions 1280(L) x 1510(W) x 1700(H) mm
Weight Total Mass 1750 kg
Power Electrical Requirements 220V±10% 50Hz/60Hz 5A
Power Consumption Energy Usage 1.2 kW
X-ray Tube Type Closed
Max. Voltage Operating Voltage 130 kV
Max. Power Power Output 66 W
Spot Size Resolution 7 μm
X-ray System Intensifier FPD
Monitor Display 27" HD
System Magnification Zoom Capability 1600 X
Detection Region Max. Payload Size 645 x 670 mm
Detection Region Max. Detection Size 565 x 510 mm
X-ray Leakage Safety Standard <1 μSv/h
Frequently Asked Questions
How is the equipment packaged for delivery safety?

All X-ray inspection machines are packed in standard strong wooden cartons to ensure safe shipping and transportation.

What warranty and after-sales service do you provide?

We offer a 1-year warranty with free spare parts and lifetime technical support. Our professional after-sales team provides comprehensive assistance, including instructional videos for troubleshooting.

Do you provide training for visiting customers?

Yes, we warmly welcome customers to visit our factory and provide complimentary training sessions to ensure proper equipment operation and maintenance.

Product Images
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment

Product Tags:

2.5D X-ray inspection equipment

      

BGA assembly imaging machine

      

SMT void detection X-ray

      
China High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment wholesale

High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Images

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